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Product Details:
Mixed Technologies - SMT & Through Hole
In excellent condition
In-line AOI Systems for Electronics Assembly VT-9300 solutions feature advanced 2-D and 3-D inspection techniques for accurate, consistent detection of paste, component placement and solder joint defects at full line speeds. With their flexible inspection capabilities and fully integrated process control tools,
VT-9000 systems enable you to improve your product quality and reduce your manufacturing costs.
VT-9000 solutions offer you:
-Cost-effective performance for all inspection stages at full line speeds
-Advanced 2-D and 3-D techniques for accurate, consistent defect detection
-Fully-integrated software tools for intelligent process control
-Straightforward program setup and flexible adaptation to product changeovers
-Compact design for easy integration into existing SMT lines
Maximum Board Size 508 x 380 mm (20 x 15 in.) Optional 508 x 457 mm (20 x 18 in.)
Maximum Board Height Top: 50 mm (2 in.); bottom: 80 mm (3in.)
Test Platform X, Y, Z table with high-resolution glass scale encoders
Control System High-speed, latest generation Pentium-powered PC with CD-ROM and 3.5 floppy drive, 15" flat screen monitor
Host Communications Twisted pair Ethernet supporting TCP/IP or Microsoft Network
Image Processing Video frame-grabber card with multi-bank memory support
Board Handling Automatic board handling and width control; SMEMA compatible
Design Conforms to CE and UL safety regulations
Dimensions W 1115 x D 1180 x H*** 1400 mm (W 43.9 x D 46.4 x H 55.1 in.)
With high speed handler option: W 1715 x D 1118 x H*** 1400 mm (W 67.5 x D 44.0 x H 55.1 in.)
Model Specifications:
VT-9300 HD Post-Solder AOI System
Boards Inspected : Post-solder SMT, through-hole and mixed technologies
Number of CCD cameras: 13
Fault Coverage: Component placement accuracy in X, Y and Q, missing components, component polarity, insufficient or excess solder, tombstone and
billboard components, dry joints, coplanarity, shorts, lifted leads,Blow Holes (Wave Solder)
Camera: Advanced 3-D imaging utilizing multiple top and angled CCD sensors
high-speed and high-resolution operation. and two different resolutions for high-speed and high-resolution operation.
Lighting: Multiple level and directional Xenon flash lighting array; closed loop
lighting array; closed loop illumination control.
Components Inspected: All chip components (including 0201)*, all leaded devices down to 0.4 mmfine-pitch and below. Many odd-form components including edgecomponents including edge connectors, coils etc. connectors, coils etc.
High Speed Mode : FOV size 50 x 37 mm (1.97 x 1.46 in.), pixel size 55 x 44 microns
High Resolution Mode: FOV size 11.0 x 8.0 mm (0.43 x 0.31 in.), pixel size 25 x 20 microns
Scan Speed: Up to 26.5 cm2/sec (4.01 in2/sec)**
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