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Product Details:
Utilizes high-speed on-the-fly vision component inspection & recognition system capable of imaging and precisely positioning virtually any Surface Mount Device. With the proven ability to place 0201, 0.3mm QFP, BGA, BGA, CSP, Connectors, and odd-form SMDs.
Advanced vision technology, the head-mounted, 'on-the-fly', scan camera system and 'fly-by' stationary camera system for larger components.
Placement accuracy of 30m is guaranteed by the design of a rigid one-piece cast iron frame, that features a unique XY-axis drive cooling system, with precision dual-drive Y-axis servo mechanics, and servo controlled, direct-drive Theta-rotation. Performance enhancing options include quick feeder bank changing that increases utilization by decreasing change-over times to as low as 60 feeders in less than 60 seconds.
Model Specifications:
Integrates the Speed of a Chipshooter with the Multifunction Capability of an IC Placer
18,700 CPH per IPC9850-1608C
30m Placement Accuracy for QFPs
0201 Chip Components
0.3mm Fine Pitch, BGAs, CSPs
Up to 54mm Square, or 80x34mm Components
120 Tape & Reel Feeder Capacity
40 Inputs for JEDEC Trays
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