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The CAMALOT 3700 System is a reliable in-line
dispensing systems with contact heat (vacuum or nonvacuum)
used for flip chip underfill and encapsulation. The
3700 system is reliable, durable, has a streamlined design and is easily adaptable to handle a
variety of substrates and circuit boards for customers' specific applications.
The system utilizes ball screws and servo motors (with closed-loop encoders) on all three axes to assure
smooth, precise and accurate dispensing with an easy-to-use enhanced Graphic User Interface. It is designed for semiconductor packaging, as well as for the circuit board industry, and uses a
conveyorized system to accommodate components in Auer® boats, JEDEC trays, ceramic substrates, lead
frames and circuit boards.
Speedline Technologies has the largest customer support network in the electronics and semiconductor
industries, developing, manufacturing and supporting product innovations for its customers, offering a
single-source for complete process solutions.
Available options and accessories for the CAMALOT 3700 and 5700 systems include the following: auto
vision alignment with "one snap" fiducial correction, die edge detection, automatic Z-height sensors by
touch probe or non-contact laser, automatic needle calibration station, loaders/unloaders, as well as a selection of CAMALOT pumps.
System Benefits
THERMAL UNIFORMITY
• Contact heat offers manufacturers the capability to direct the heat to the substrate or part,
where it is needed.
• Most cost-effective heating solution for advanced semi- conductor packaging applications,
such as encapsulation and flip chip underfill. Contact heat ramps up faster and makes it
easier to maintain temperature throughout the process.
• Contact heat with vacuum locator at dispensing zone is standard. Additional heating
systems at pre-dispense and post-dispense zones are optional.
FAST, RELIABLE PLATFORM AND INCREASED THROUGHPUT
• Linear bearing slides for smooth point-to-point movement and input/output zones (buffers)
to reduce substrate transport time.
• Interchangeable contact heat top plates provide quick changeover time for customers with
several components or substrates.
• Precise thermal control ensures repeatability and accuracy with fast temperature ramp-up
and stability.
• Contact heat system provides temperatures from ambient to 125ºC.
FLEXIBLE
• Handles multiple substrate carriers (Auer ® boats, JEDEC trays, etc.)
• Handles flexible substrate sizes* - 3700: up to three 8.5" or two 12" lead frames, boats or
carriers 5700: up to three 12" lead frames, boats or carriers.
COMPACT FOOTPRINT
• Saves valuable cleanroom space.
GLOBAL COMPATIBILITY
• Designed to SEMI-S2 and CE requirements
• SMEMA compatible for in-line automation integration
TYPICAL APPLICATIONS
Flip Chip on organic, ceramic, flex and other substrates
Dam and fill encapsulation, glob top and fill on organic, ceramic and flex
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