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Die Bonder

Statistics: views/answers:99/0
Posted by:
sheilawu
Location:
Asia and Pacific - China
Ad Status:
Active

Company:
JAF
Announcement Type:
New Product Release
URL:

Description:
Bonding Accuracy: ±80μm; ±20 ;
Bonding Speed: UPH〉5000
Wafer Size: max 8 inches
Dimensions: 1810(W)X1035(D)X1446(H)
Weight: 1200KG
Air Pressure: 0.5 MPa
Voltage: 220VAC
Power: 1800W

Company: Dalian jafeng semiconductor Device Co.,Ltd
Contact Name: sheila wu
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Ad Number: 113113
Die Bonder, JAF
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