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1）Applied in semiconductor wafer’s cleaning and etching;
2）Standard etching process,use HF/HNO3, KOH, NaOH, H3PO4, BOE, DHF, SPM, SOM and etc.
3）Control mode: Manual,semi-auto,Auto.;
4）Material:Depending on process and customer requirement,available matierials eg.PP,PVC,PVDF,Quartz Tube,Stainless steel and others;
Features and benefits:
A. Module design;Depending on customer requriment and process,offer special solution;
B. Customization based on customer budget;
C. Optimum wet cleaning solution;
D. High PPR;
E.Various options available:;
F. Operator friendly and safe;
G. Easy maintenance;
Non-standard product,please contact for special process solution with your requirement!
For more product infos, please download: CSE Semiconductor Product Catalogue.
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