The Dicing saw is a back-end processing tool for cutting wafers into chips for further processing.
•Integrated semiautomatic computer controlled precision saw. It is menu driven, with a multi axis cutting stage with automatic indexing.
•Employs an extremely thin diamond impregnated cutting wheel with water cooling. The two inch wheel is mounted on an air spindle which is driven speeds up to 30,000rpm.
•The chuck accepts up to 6" diameter wafers.
•Video monitor for online inspection and alignment.
•Capable of cutting a wide variety of materials such as silicon, quartz, ferrite, metals, glass, ceramics and sapphire.
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Ad Number: 162203
About this K & S DICER listing - This is a for sale classified ad for a used, surplus or second hand K & S DICER equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this K & S DICER listing or view this user's member profile for detailed contact info.
:50/0
