|
Dynatex GST-100 Scriber/Breaker System consisting of:
- Model: GST-100
- Complete, automatic scribing and breaking of many substrate materials.
- Max Wafer Size: 100mm max (4")
- Wafer thickness: 40 um to 1725 um(material dependant)
- Minimum die size: 200 um square
- Minimum wafer index: 5 um
- Maximum wafer index: 100 mm
- Maximum backside metal: 10 um
- Scribe channel width: <5 um
- Load time: <15 seconds
- Alignment time: <30 seconds
- Scribe speed: 2mm/sec
- Break rate: 2 breaks/sec.
- Break method: patented impulse bar
- Wafer mounting: Standard metal saw frames
- Substrates: saphire, GaAs, LiNbO3, Glass, InP, GaP, Silicon, Quartz
- Break Method: Patented inpulse bar
Vision System:
- Digital Hi-Res BW/Color camera
- 17" flat panel montitor
- Pattern recognition system for auto alignment
- Edge detection for automatic bar and piece alignment
- GST-100 Auto step-correction
Programmable on GST-100:
- Scribe tool life, scribe angle, scribe approach speed, scribe force, scribe speed, scribe extension, break force, multiple die size, fiducial image storage, wafer type and profile, multiple wafer profile storage. (Profile programmable in metric or imperial units)
- Operations Manual and Documentation
Welcome for inspection.
Thanks
Semimax Korea Corp.
|
:54/0
