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Deinstalled July 2007

Stress Measurment
The FSM 128 uses a laser optical lever to measure the change of curvature induced in a wafer due to deposited film.

Pattern wafer measurment
The FSM 128 can perform non destructive measurment of pattern wafer bow from the front side of the wafer

Wafer Flatness Measurment
This application allows inspection of incoming wafers to ensure they meet wafer flatness specifications, the results quantifies and displays wafer topography in 3D or contour mapping for identification purposes.

TEMPERATURE RANGE: ROOM TEMP

MEASUREMENT TYPE: NON DESTRUCTIVE OPTILEVER LASER SCANNING.

WAFER SIZE: 3" TO 8" (75mm TO 200mm), 300mm OPTIONAL.

AUTO DUAL LASER: 750nm AND 810nm. OTHER WAVELENGTHS ARE AVAILABLE.

AUTO CALIBRATION AND AUTOINTENSITY: INSENSITIVE TO INSTRUMENTAL DRIFT, ENVIROMENTAL AND TEMERATURE CHANGES.

ROTATION: MOTORIZED 0 TO 360 DEGREES FOR FAST 3D MAPPING AND LOCAL AREA SCAN.

MINIMUM RADIUS: 2 M

SCAN RANGE: < 1mm TO 200mm. 300mm OPTION

MEASUREMENT SPEED: 8 SECONDS FOR 200mm SAMPLE (8000 DATA POINTS)

MEASUREMENT RANGE: 1 x 10(7), to 4 x 10(12) DYNE/CM(2) , WHICHEVER IS GREATER.

REPEATABILITY (1 SIGMA) : BETTER THAN 1.0% VARIANCE OR 4.0x10(6) DYNES/CM(2), WHICHEVER IS GREATER.

ACCURACY: BETTER THAN 2% USING PRECISION MIRROR OF 20M RADIUS OF CURVATURE.

COMPLIANCE : CLASS IIIB LASER PRODUCT 21 CFR 1040

CE MARK : COMPLY

CLEAN ROOM COMPATIBILITY : YES

COMPUTER : 586 PC. 3.5" FLOPPY. 1GB HARDDISK, SVGA MONITOR.

DIMENSIONS : 14.25"(W)x20.5" (D)x15.25"(H)

SHIPPING WEIGHT WITH PC : 125 LBS

POWER: 110/230V, 50/60 HZ