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Royce Instruments 580 Universal Bond Tester for Wire-Pull, Die Shear, and Bond Shear Testing
The unit was remove from service in working condition. It was Intel surplus. The unit appears complete. I have tested basic power function but we do not have all facility requirements needed to run this system. The unit did not seem recognize the Bond Test Module and it probably needs to be repaired.
The Unit's Serial Number Tag Reads:
Serial Number: 1001935
Additional Information from the System:
# Version 42.08.18
# NEC MultiSync 15" LCD Monitor
# 700 MHz Pentium III CPU with 128 MB of RAM. Serial Number: 1001873
# CUDA Fiber Optic Light Source. Model Number: I-150, Serial Number: 1040539
# Optim Light Source. Catalog Number: 29-60-73
# Optim Zoom 70 Camera, .37x. Catalog Number: 29-65-84
# Leica S6 Microscope with 20x/12 Eyepieces, Eye Piece Catalog Number: 10446356
# TMW-100G-12798 Wire Pull Module, Range: 100g (1 N), Resolution: 10 mg (0.1 mN), Serial Number: 1001476
# TMS-250G-12677 Shear Module, Range: 250g (2.5 N), Resolution: 25 mg (0.25 mN), Serial Number: 1001268
# Stage Controller, Serial Number: 1001936. Tool Controller, Serial Number: 1001937
Description:
The System 580 bond tester performs wire pull, stud pull, bond shear and die shear tests. Tests are set up by quick change, auto programming, test modules. Each test module has superb accuracy and such fine resolution that changing ranges is unnecessary.
A rich choice of test piece tooling is avail-able to suit a wide range of package styles. The System 580 can be used either as a fully capable standalone test machine or with a networked PC, running Windows 2000 and BondTest Manager software. Using industrial quality computer modules and a solid state disk, the System 580 mainframe is a robust test instrument for low cost of ownership.
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:998/3