erial number W21XX639 Used with KLA 2552 ( also available for sale) Deinstalled by KLA, Warehoused, barrier bagged. The system was deinstalled in september 2002 and until that date was upgraded with various hardware and software upgrades. Stored at the warehouse at Avezzano, Italy Facilities: 120v 3 phase 25A per phase KLA2132 Board Configuration *************************** MAIN CARD CAGE DP 710-683424-001 REV AA DF 710-661726-00 BD1 API 710-658036-00 REV C1 API 710-658041-20 REV E0 UP 710-658046-00 REV F0 XINT 710-658176-00 REV A0 YINT 710-658172-00 REV H0 XINT 710-658176-00 REV A0 YINT 710-658172-00 REV H0 CT 710-655651-20 REV C0 CT 710-655651-20 REV C0 MM 710-659412-00 REV C0 MM 710-659412-00 REV C0 MC 710-658232-20 REV H0 IF1 710-658086-20 REV E0 AUXILIARY CARD CAGE ******************* DF 710-678525-001 REV AB DD 710-650044-20 REV DB0 DP 710-678545-00 REV B1 RTF 710-652840-20 REV D3 710-659485-20 REV?? General Description ---------------------------- The KLA 2132 is capable of inspecting at the following rates: Sensitivity: 0.62 ------- Speed: 5 sec/cm2 Sensitivity: 0.39 ------- Speed: 15 sec/cm2 Sensitivity: 0.25 ------- Speed: 30 sec/cm2 and includes the following:- wafer inspection module for 4, 5, 6 or 8 inch wafer size image Computer Minimum inspectable feature size of 0.25 um in die to die mode Defect Clustering and Auto Review Sampling Blanket Wafer Inspection Automated Inspection Automatic Focusing SECS-GEM KLA SAT segmented auto threshold imaging processing hardware and software using mean and range functions on the KLA 2132 and KLA 2135 platforms that allows. improved inspection performance on noisy surfaces like CMP and metal reduced inspection setup time enhanced threshold algorithm for all process levels KLA ADC Automated Defect classification Package Includes image processing and analysis software for inspection station .The system has internally two computers: one is the system computer, which controls the machine in run mode; and the other is the ADC computer, which controls the machine in automatic review mode (you can also do manual review mode). The ADC Manager is not included. Fully automatic, non-contact wafer alignment Uses image recognition without special test site requirement Accomodates SEMI standard 25 wafer cassettes Uses pick-and-place, random access wafer handling system Image hard copy Remote image access XV Tencor 6000 loader SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1 Wafer diameter (mm): 100 100 125 150 200 Wafer thickness (?m): 525 625 625 675 725 SENSITIVITY AND INSPECTION SPEED: Die to Die Mode Cell to Cell Mode Sensitivity (?m) Speed (sec/cm?) Sensitivity (?m) Speed (sec/cm?) 0.60 05 0.50 1.5 0.40 15 0.30 05 0.25 30 0.20 15 Full performance specifications are available on request
Company: SDI Semiconductor Instruments Group Contact Name: Stephen Howe Status:Premium Member
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Ad Number: 22491
About this KLA- Tencor 2132 listing - This is a for sale classified ad for a used, surplus or second hand KLA- Tencor 2132 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this KLA- Tencor 2132 listing or view this user's member profile for detailed contact info.
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