Dymatix/Viking 1010D/1010 Tape Frame Die-Demounter

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testeqe

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Arizona

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Description:

Dymatix/Viking Semiconductor 1010D Die-Demounter for 8" (200mm) Wafers

The Unit's Serial Number Tag Reads:
Model Number: 1010D
Serial Number: 048
Manufacturer's Date: Dec, 2000

Key Features:
# Up to 8" wafer capability
# Semi-automatic operation insures no yield loss
# One setup runs all die sizes
# Versatile, easy-to-use
# Safe handling of die
# No mechanical adjustments

1010, 2010 & 3010 Demounters:
The DYMATiX family of Demounters offers reliable, low-cost solutions for the removal of die from sawn film frames. The machines are user-friendly and require no mechanical adjustments, which means the operator can run all die sizes with only a single setup.

Operation of the machines is easy. The operator places the film frame on the unit. The Demounter then separates the die from the tape, spreading the die loosely on a removable tray, while still maintaining the original orientation. This entire process takes less than 30 seconds. The tray can then be taken to another area for manual die sorting. Using several of these trays allows a number of operators to sort die simultaneously.

The 1010D peels die as small as .070-inch square (1.75mm) from wafers up to 200mm in diameter.

Specifications:
Maximum Wafer Size: 200mm (8")
Minimum Die Size: 1.78mm (0.070")
Minimum Die Thickness: 0.38mm (0.015")
Maximum Film Frame Inner Diameter: 245mm (9.64")
Die Material: Si, GaAs, and other sawn material
Wafer Tape: < or = to 0.07mm thickness (0.003")
Electrical: 120 VAC, 50/60 Hz, 2.0 Amps
Air: 30 psi CDA
Dimensions: 34" x 19" x 11" (high) (86 x 48 x 28cm)
Weight: 60 lbs (27 Kg) - does not include packaging for shipment