Copper deposition system
NuTool 2000 is an advanced copper deposition system that uses patented Electrochemical Mechanical Deposition (ECMD) technology to deliver a planar copper deposition with aspect-ratio-independent filling of features and with low field thickness. These features combine to reduce the cost of copper CMP while increasing product yield. ECMD technology also makes possible new types of devices and processes, such as wet etching of copper instead of CMP. Demonstrated results include filling vias <0.1µm wide with aspect ratios of 10, and filling 2.0µm-deep trenches with widths from 0.14-2000µm on the same die, while keeping the copper field thickness below half of the feature depth. NuTool 2000 is designed as a bridge tool, allowing for both 200mm and 300mm production, with minimal changes needed for conversion. NuTool 2000 can process 200mm and 300mm wafers on the same system, using the same electrolyte for both wafer sizes.
Company: Equipment Exchange Contact Name: Lezlie Paul Status:Premium Member
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Ad Number: 74758
About this NuTool 2000 NuTool 2000 listing - This is a for sale classified ad for a used, surplus or second hand NuTool 2000 NuTool 2000 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this NuTool 2000 NuTool 2000 listing or view this user's member profile for detailed contact info.
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