- Hardware configuration
* chamger and lid : Al;chamber with cooling water
* heater : SST;stationary resistive heater
* heater max. temp : 500 degree C
* reflector : SST
* Cryo pump : CTI P300 cryo w/chevron baffle
* water lift hoop : SST;hoop w/three wafer lift edge fingers
- Process
* Ar backfill pressure set point : 6 Torr - 10 Torr
* heater set point : 150C~500C
* needle valve set for Ar backfill rate control : ~5sec from UHV to 10 Torr
* degassing set time : 30sec~45sec
- Chamber base pressure
* lowest base pressure : 1.2x10-8 Torr
* base pressure recovery : <1hr from 1atm to 5x10-7Torr after 2hrs exposure to the air
- Heater temperature
* heater temp uniformity : 500C+/-7C
* heater temp ramp up : <70min from RT to 500C
* heater cooldown : <200min from 500C to 60C
- Wafer temperature
* wafer temp ramp up : 20sec from RT to >440C on 482C heater
* wafer temp uniformity : 450C+/-8C on 482C heater
* wafer temp cooldown rate : <1.5C/sec after cryo isolation valve open
- Cryo pump regeneration
* # of cycles between cryo regen:
~4,000 for 10Torr Ar backfill
~5,000 for 8Torr Ar backfill
>40,000 with 1sec rough pumping
This chamber is a brand new one and can be shipped immediately.
SMT International Co.,Ltd.
Company: SMT International Co.,Ltd. Contact Name: Moon S. Shin Status:Premium Member
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Ad Number: 79955
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