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The Temptronics ThermoStream Model TP04300 is high power, full featured airstream system that delivers controlled temperature with speed and precision to small and large devices, modules, PCBs and assemblies for thermal cycling, profiling and testing. The unique no-arm design of this system provides a convenient temperature source for use with clamshell or front loader ThermoChambers™ and custom fixtures.

Temperature Range: -80 to +225C

SYSTEM PERFORMANCE

Airflow: High capacity 9 l/s (18 scfm) continuous airflow optimizes temperature transition rate and throughput

Typical Temperature transition rate: -55 to +125C: approximately 7 seconds, +125 to -55C: approximately 20 seconds

Temperature Control: Air or Patented DUT Dual Loop directly at the DUT case to +/-0.1C

DUT Sensor Ports: Four (4): Internal Diode, Type T or Type K thermocouple, and 100 ohm RTD

Temperature set, display and resolution: +/-0.1C

Temperature Accuracy: 1.0C (calibrated to NIST standard)

Remote interface ports: Four (4): IEEE-488, RS232C, SOT/EOT/SFF, Ethernet.

OPERATING FEATURES

Controls: User Control at Color Touch-screen at front panel or via remote interface

Two (2) modes of operation:
Operator Mode: Test and cycle at Hot/Ambient/Cold temperatures Cycling Mode: Utilize up to 18 thermal cycling sequences, graphing, datalogging, and other advanced features.

Cycling Mode: Utilize up to 18 thermal cycling sequences, graphing, datalogging, and other advanced features.

APPLICATIONS:
Test and cycle a DUT under a variety of conditions, creating test sets of up to 18 cycling sequences. Graphing, datalogging and printer port features assist in documentation.

For 24 hr/ 7 day test environments, the TP04300's high capacity airflow and DUT thermal precision ensure high throughput with consistent repeatability. Operator's Mode ensures quick set-up for testing at up to three temperatures.

Thermal source for applications requiring precisely controlled thermal air, including the ThermoFixture enclosure/ATE interface for thermally testing PCB, modules, assemblies, digital, high frequency (RF, microwave), and high power devices.