K&S 1488Plus Gold Wire Bonder

Posted by:

Semimax

Location:

Asia and Pacific - South Korea

Ad Status:

Closed

Manufacturer:

Type:

Model:

Year (or range of years):

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Price (in US dollars):

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Description:

Bonding System XY Resolution ㎛ 2.5
Bondhead Resolution ㎛ 2.54
Bonding Accuracy ㎛ ± 3.5
at 1 Sigma
Bonding Method 　 Thermosonic
Bonding Speed ms/ wire 100(STD) 115(Loop control) at 2.0 mm
Bonding Area ㎜ 50.8 × 50.8
Fine Pitch Capability ㎛ 80
No. of Bonding Wires 　 1750
Wire Length mil Max. 250
Wire Size mil 0.9 ~ 2.0(STD) 2.0~3.0(Option)

Ready for sales whether for lot or single releasement.

Welcome for inspection.

Thanks
Semimax Korea Corporation