This is a near new, very lightly used (process development tool only) Datacon 2200+ apm. Included options are 300mm wafer cassette, automatic multi pick-up tool and die ejector systems, upward looking camera (bump alignment), die flipper, Input/Output substrate handling buffers, heated (to 400 C) bonding stage and machine capability test kit. As noted it is in like new condition. List price for this system was more than $500k USD. Accepting offers now.
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Ad Number: 110101
About this Datacon 2200+ apm listing - This is a for sale classified ad for a used, surplus or second hand Datacon 2200+ apm equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this Datacon 2200+ apm listing or view this user's member profile for detailed contact info.
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