Datacon APM 2200 - Flip Chip & Flexible Die Bonder
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Posted by:
LCJ
Location:
California
Ad Status:
Active
Manufacturer:
Datacon (Besi)
Type:
Flexible Die & Flip Chip Bonder
Model:
2200 apm
Year (or range of years):
2003
Condition:
As New - Flawless
Price (in US dollars):
USD
Quantity:
1
Type of Seller:
Dealer Non-Owner
Description:
Datacon 2200apm Flip Chip & Flexible Assembly System:
Machine is in flawless condition and includes all options for most type of Die Bonding, Inclcuding:
High accuracy kit (10 um/3sigma)
Theta-Axis rotary bondhead (0-360 deg)
Upward looking camera
Flip Chip and Dip station
Bond force sensor
Z position bond tool holder (500g)
Heated Bond Station
Automatic wafer/frame transfer system
PDP Dispense Pump (DL Technology)
Large Die Kit (to 35mm)
Multi-chip ejector carousel
Automatic Pick/Place tool change unit
Programmable Automatic Transportation System w/ Input/Output buffers
Calibration tool kit
Stereo microscope
Universal needle kit
Step up transformer for 110V operation (machine is 220V)
Complete Documentation package
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Ad Number: 110238
About this Datacon (Besi) 2200 apm listing - This is a for sale classified ad for a used, surplus or second hand Datacon (Besi) 2200 apm equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this Datacon (Besi) 2200 apm listing or view this user's member profile for detailed contact info.
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