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Classifieds / Semiconductor Equipment / Wire & Die Bonder

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ESEC 2007 BGA 8inch Epoxy Die Attach

:1143/14

Posted by:	Semimax
Location:	Asia and Pacific - South Korea
Ad Status:	Closed

Manufacturer:	ESEC
Type:	8" Epoxy Die Attach
Model:	ESEC 2007 BGA
Year (or range of years):	1998
Condition:	Complete and Excellent
Price (in US dollars):	Pls e-mail for USD
Quantity:	2
Type of Seller:	Dealer Owner

Description:
ESEC 2007 Epoxy Bonder, Stack to magazine configuration, installed, 8", Programmable dispenser, QC option, BGA option, wafer loader, Barcode reader, programmable dispenser, has singulated parts handling capability but can also handle matrix strips, QC camera, BGA camera, and PD, very good condition, currently installed, Inspection is always welcomed,1997-1998 vintage. Thanks Semimax Korea Corporation

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About this ESEC ESEC 2007 BGA listing

- This is a for sale classified ad for a used, surplus or second hand ESEC ESEC 2007 BGA equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this listing or view this user's profile for detailed contact info.