New Users | Contact Us | Help
used equipment second hand machine image
Browse Ads
Create Ad
Login
Username

Password


Site Stats
Members:  31402
Current Ads:  27654
 
Language
Classifieds
[<] [>]
Used JAF HS-DC02 for sale - Enlarge Picture

High speed Epoxy Die Bonder

Statistics: views/answers:45/0
Posted by:
sheilawu
Location:
Asia and Pacific - China
Ad Status:
Active

Manufacturer:
Type:
Model:
HS-DC02
Year (or range of years):
Condition:
Price (in US dollars):
USD
Quantity:
1-
Type of Seller:
Dealer Owner

Description:
UPH: >9000
Wafer: Max 8 inches (200mm)
Wafer Table: 237.5*237.5mm
Bonding Accuracy: ±50μm, ± 3 degree
Chip Size: 0.2mm*0.2mm-2mm*2mm
Application: Leadframes, PCB
Dimension of Leadframe:
L: 6.0"-11.4" (150-290mm)
W: 0.6"-3.15" (15-80mm)
H: 4-30mil (0.1-0.75mm)Demision:
Unpack: 1810*1035*1446mm
Packed: 1910*1280*1710mm
Bonding Power: 30-2000g
Compressed Air: 0.5MPa ±
Voltage: 220VAC
Power: 1800 W

Company: Dalian jafeng semiconductor Device Co.,Ltd
Contact Name: sheila wu
View Member's Other Listings

Send an E-Mail to this Member Send this Ad (Link) to a Friend
Print this Ad adid=114732 onClick='enterWindow=window.open("/favorits.php?adid=114732","Favorites","width=400,height=200,top=200,left=200"); return false' onmouseover="window.status='Put this Ad in My Favorites'; return true;" onmouseout="window.status=''; return true;"> Put this Ad in My Favorites
Member Details

Ad Number: 114732
About this JAF HS-DC02 listing - This is a for sale classified ad for a used, surplus or second hand JAF HS-DC02 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this JAF HS-DC02 listing or view this user's member profile for detailed contact info.