ASM 809-M06 Feature:
Multi-Processor Controlled System
Adjustable Bond Force 40-200Gram
Capable Die Size: 7x7Mil till 40x40Mil
XY Table travel Range 8x4 inch( 14x4 Optional)
Multi-wafer system to handle 4 different wafer of simulate die size
Welcome for inspection
Thanks
Semimax Korea Corporation
Company: Semimax Korea Corporation Contact Name: David Liu Status:Premium Member
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Ad Number: 116200
About this ASM HONGKONG ASM AD809-M06 listing - This is a for sale classified ad for a used, surplus or second hand ASM HONGKONG ASM AD809-M06 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this ASM HONGKONG ASM AD809-M06 listing or view this user's member profile for detailed contact info.
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