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ASM AD809 M06 Multi Wafer Die Attach


Posted by:
Location:
Asia and Pacific - South Korea
Ad Status:
Closed

Manufacturer:
ASM HONGKONG
Type:
Multi Wafer Die Attach
Model:
ASM AD809-M06
Year:
2001
Condition:
Excellent
Price:
Pls e-mail for USD
Quantity:
3
Type of Seller:
Dealer Owner

Description:
ASM 809-M06 Feature:
Multi-Processor Controlled System
Adjustable Bond Force 40-200Gram
Capable Die Size: 7x7Mil till 40x40Mil
XY Table travel Range 8x4 inch( 14x4 Optional)
Multi-wafer system to handle 4 different wafer of simulate die size

Welcome for inspection

Thanks
Semimax Korea Corporation

This ad has been Closed!

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2. It has been marked as SOLD or FOUND by the poster.

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Ad Number: 116200
Views: 1442 | Replies: 11
About this ASM HONGKONG ASM AD809-M06 listing - This is a for sale classified ad for a used, surplus or second hand ASM HONGKONG ASM AD809-M06 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this listing or view this user's profile for detailed contact info.
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