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Classifieds / Semiconductor Equipment /

Wire & Die Bonder


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ESEC Micron 2, II Flip Chip / Die Bonders
Active
Make: ESEC
Model: Micron 2
Seller: neologic
Loc: Asia and Pacific - Other
 
Datacon APM 2200 Dual Dispenser
SOLD
Make: Datacon
Model: APM 2200
Seller: neologic
Loc: Asia and Pacific - Other
 
RAD-3700
Active
Make: Lintec
Model: RAD-3700
Seller: jess-song
Loc: Asia and Pacific - South Korea
 
ESEC2006 & Spare Part
Active
Make: ESEC
Model: DA2006HRX
Seller: Ben_Li
Loc: Asia and Pacific - China
 
Palomar 3500-III Factory Refurbished
Active
Make: Palomar/Hughes
Model: 3500-III
Seller: BonderBuyer
Loc: U.S.A.
 
Shinkawa Vidicon tube
Active
Make: Shinkawa
Model: CMU-03N
Seller: Marquis
Loc: Asia and Pacific - Other
 
Orthodyne 360C Wire Bonder
Active
Make: Orthodyne
Model: M 360 C
Seller: silicom
Loc: Europe - Germany
 
KARL SUSS FC 150 / FC150
Active
Make: KARL SUSS
Model: FC 150 / FC150
Seller: Semi4Evaz
Loc: U.S.A.
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Related: Semiconductor Manufacturing, Wafer Inspection, Wafer Handling, CVD Equipment, Teradyne
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