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Die Bonder

Statistics: views/answers:117/1
Posted by:
CMTec
Location:
Europe - All
Ad Status:
Active

Manufacturer:
Type:
Model:
2008xP3
Year (or range of years):
2005
Condition:
as good as new
Price (in US dollars):
on request USD
Quantity:
2
Type of Seller:
Dealer Owner

Description:
Die Bonder with 300mm wafer handler.
Can be configured to smart card bonder.

Company: n/a
Contact Name: Bruno Truttmann
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Member Details

Ad Number: 131138
About this Oerlikon ESEC 2008xP3 listing - This is a for sale classified ad for a used, surplus or second hand Oerlikon ESEC 2008xP3 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this Oerlikon ESEC 2008xP3 listing or view this user's member profile for detailed contact info.
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