Solder Ball Mounting machine for BGA/CSP applications
*Suitable for Research and Development or small lot production applications.
*No carrier tray or attachment jig required.
*The system uses flexible pin transfer to prevent substrate warping.
*No tool size-change parts.
Model SBM100
Model SBM100
Solder ball size 0.3 - 1.0mm diameter
Ball mounting area Max.50 x 50mm
Cycle time 12sec./Mount
Ball mounting accuracy +/- 0.1mm
Dimensions 1000(L) x 810(W) x 1640(H)mm
Net weight 1000kg
Thanks
Semimax Korea Corporation
Company: Semimax Korea Corporation Contact Name: David Liu Status:Premium Member
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Ad Number: 131524
About this Shibuya, Japan SBM-100 listing - This is a for sale classified ad for a used, surplus or second hand Shibuya, Japan SBM-100 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this Shibuya, Japan SBM-100 listing or view this user's member profile for detailed contact info.
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