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ESEC Micron2 Flip Chip Bonder

:852/4

Posted by:	Oliver88
Location:	Asia and Pacific - Singapore
Ad Status:	Closed

Manufacturer:	ESEC - BESI
Type:	Micron 2
Model:	Micron 2 - Series 15
Year (or range of years):	2002
Condition:	Very good
Price (in US dollars):	USD
Quantity:	5
Type of Seller:	Dealer Owner

Description:
This Flip Chip and Die Bonder can be equipped with wafer feeder, tape feeders, waffle pack feeder, dispenser and slide fluxer. We also provide installation, training, troubleshooting and upgrading on all ESEC-Micron2 / Micron5003 models.

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About this ESEC - BESI Micron 2 - Series 15 listing

- This is a for sale classified ad for a used, surplus or second hand ESEC - BESI Micron 2 - Series 15 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this listing or view this user's profile for detailed contact info.