ESEC Micron2 Flip Chip Bonder

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Classifieds / Semiconductor Equipment / Wire & Die Bonder

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Used ESEC Micron2 - Series 15 for sale - Enlarge Picture

:324/4

Posted by:	Oliver88
Location:	Asia and Pacific - Singapore
Ad Status:	Closed

Manufacturer:	ESEC
Type:	Micron2
Model:	Micron2 - Series 15
Year (or range of years):	2002
Condition:	Very good
Price (in US dollars):	USD
Quantity:	5
Type of Seller:	Dealer Owner
Description:
This Flip Chip and Die Bonder can be equipped with wafer feeder, tape feeders, waffle pack feeder, dispenser and slide fluxer. We also provide installation, training, troubleshooting and upgrading on all ESEC-Micron2 / Micron5003 models.

This ad has been Closed!

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About this ESEC Micron2 - Series 15 listing - This is a for sale classified ad for a used, surplus or second hand ESEC Micron2 - Series 15 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this ESEC Micron2 - Series 15 listing or view this user's member profile for detailed contact info.