Posted by:

testeqe

Location:

Arizona

Ad Status:

Active

Manufacturer:

Type:

Model:

Year (or range of years):

Condition:

Price (in US dollars):

Quantity:

Type of Seller:

Description:

MicroAssembly Technologies 6400 Automatic Thermal Die Attach System/Bonder

This unit was Intel Surplus. It was removed from service in working condition. They had advertised it as a Thermal Die Attach System / Flip Chip Bonder. We do not have the expertise or the facilities to formally test this unit and are selling it as-is. There appears to be some miscellaneous parts for the unit including different sized chucks in the blue-bin in the picture of the back of the unit.

Base List Price is: $150,000.00 to $220,000.00 NEW from MAT

The Unit's Serial Number Tag Reads:
Model Number: 6400
Serial Number: 802
Power Requirements: 220 V, 50/60 Hz, 16 A, 3520 VA
Weight: 160 kg.
Date of Manufacture: 12/03

Key Features:
# Flexible, fully automatic die attach system controlled by user friendly Windows XP based software.
# Model 6400 performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies.
# Very high placement accuracy of 3 microns @ 3 sigma (process dependent) is ensured by the closed loop servo systems and the high resolution digital vision system
# Handles active and passive components with sizes between 200 microns up to over 25 mm.
# Pick from up to thirty 2" or nine 4" Waffle or Gel packs.
# Pick from Wafers up to 300 mm
# Pick from up to 8 Tape & Reel feeders.
# Specializing in unusual die sizes and aspect ratios.
# The volumetric dispenser applies adhesive in programmable shapes.
# Stamping (Pin Transfer) applies adhesive dots as small as 75 microns.
# Full Flip Chip capability including chip flipping, bump fluxing and chip final alignment over up looking camera.
# Handles CCD and other sensors, LCD's, MEMS and other sensitive devices
# Unique die staking capability.

Specification Highlights:
Work Area: Up to 12" x 10".
Die Size: 0.200 to over 50 mm.
Die Thickness: from 50 microns.
Die Aspect Ratio: over 1:20.
Die Material: GaAs, Silicon, Glass, other.
# Die Presentation: Up to 30 Waffle/Gel packs
# Up to 8 Tape & Reel feeders
# One 300 mm Wafer.

Volumetric or Time-Pressure Dispensing
Stamping (pin transfer) for dots as small as 75 µm.
Cold or Hot process up to 500°C with Inert Gas cover (Not sure if this feature is installed but I think it is).
Heated pickup tool up to 500°C available (Not sure if this feature is installed but I think it is).
Ultrasonic bonding process available (Not sure if this feature is installed but I don't believe it is).
Accurate Bond Line Thickness control.
Advanced Die Stacking capability.
Pickup/Bond Force: 40 – 3000 grams.
Placement Accuracy: 3 µm @ 3 sigma depending on application.
Throughput: Up to 1000 CPH depending on application.