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Classifieds / Semiconductor Equipment / Wire & Die Bonder

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ESEC Micron 2, II Flip Chip / Die Bonders

:1212/7

Posted by:	advotech
Location:	Arizona
Ad Status:	Closed

Manufacturer:	ESEC / ZEVATECH
Type:	Micron 2 - II
Model:	Series 12
Year (or range of years):
Condition:	Very Good
Price (in US dollars):	35000 USD
Quantity:	2
Type of Seller:	Non-Dealer

Description:
ESEC/ ZEVATECH Micron 2 Flip Chip and Die Bonder. The machines have been thoroughly inspected and are ready for immediate demo or shipment. Installation and training are available. Please contact us for more information.

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About this ESEC / ZEVATECH Series 12 listing

- This is a for sale classified ad for a used, surplus or second hand ESEC / ZEVATECH Series 12 equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this listing or view this user's profile for detailed contact info.