Posted by:

discosaw

Location:

Asia and Pacific - South Korea

Ad Status:

Active

Manufacturer:

Type:

Model:

Year (or range of years):

Condition:

Price (in US dollars):

Quantity:

Type of Seller:

Description:

Applications;Eutetic bonder for High power LEDs.

Super high-speed (0.20sec./chip) and high accuracy
( X,Y =±25μm, θ=±1°)
Actual production speed : 0.2sec./die

High-speed recognition unit for high density leadframe

MTBA=4 hours ensures minimum down time

User friendly touch screen operation through GUI

Applicable for strip type and reel type leadframe

Wafer mapping　
Snap cure oven (for in-line system)

SECS I/II, GEM