Posted by:

c4salesforce

Location:

U.S.A.

Ad Status:

Active

Manufacturer:

Type:

Model:

Year (or range of years):

Condition:

Price (in US dollars):

Quantity:

Type of Seller:

Description:

The SIPLACE A-1 is a multi-chip/multi-placement
bonder.

Toolchanger max. 12 stamping or
pick&place tools

Chip-eject system max. 8 needle systems, freely
configurable, in programmable
sequence

Working area max. 640 x 150 x 25 (L x W x
H)

Eutectic heater max. standard size 30 x 35
mm with programmable rapidramp
technology and cooling
system

Chip sizes Edge length 0.25 to 20mm,
Thickness min. 150 μm (optional
50 μm)

Chip input Flexible handler for wafer frames
or rings, waffle or gel
packs, with max. 17 slots
(mixable)

Wafer sizes up to 8“

Positioning accuracy typically ± 10 μm, depending
on the application

Throughput typically 1000 to 1500 dies/
hour, depending on the application

Bond force adjustable in the range
8 - 200 cN

Interface Standard TCP-IP interface,
optional SMEMA interface