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Classifieds / Semiconductor Equipment / Wire & Die Bonder

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ESEC 2007 BGA IC8 Die Bonder

:1033/3

Posted by:	Semimax
Location:	Asia and Pacific - South Korea
Ad Status:	Closed

Manufacturer:	ESEC
Type:	Epoxy Die Bodner
Model:	ESEC 2007BGA
Year (or range of years):	1997~8
Condition:	Excellent
Price (in US dollars):	Pls E-mail USD
Quantity:	2
Type of Seller:	Dealer Owner

Description:
Machines are inline working condition, along with full sets of manual books. Please e-mail us for your quotation and specification sheet. Welcome for inspection Semimax Korea Corp.

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About this ESEC ESEC 2007BGA listing

- This is a for sale classified ad for a used, surplus or second hand ESEC ESEC 2007BGA equipment. It is posted by one of our members. To contact the seller of this item please click the WebMail icon at the bottom of this listing or view this user's profile for detailed contact info.