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Current Ads:  22244
 
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Classifieds
Classifieds / Semiconductor Equipment / Wire & Die Bonder
1 2 3 4 5 6 7 Next
Unitek Miyachi Micro Precision Welding Station
New!
Make: UNITEK MIYACHI MICRO
Model: 1-292-01-01
Seller: larryO
Loc: California
Dage 4000 Wire Pull & Ball Shear Microtester
New!
Make: Dage INC
Model: Dage 4000
Seller: Semimax
Loc: Asia and Pacific - South Korea
Orthodyne 20 Heavy Wedge Bonder
New!
Make: Orthodyne
Model: 20B
Seller: Semimax
Loc: Asia and Pacific - South Korea
ASM AD809C 6inch Epoxy Die Attach
New!
Make: ASM HONGKONG
Model: ASM AD809C
Seller: Semimax
Loc: Asia and Pacific - South Korea
ESEC 2007 IC8 D136/D137
New!
Make: ESEC
Model: 2007 IC8
Seller: dynamicmos
Loc: Asia and Pacific - Other
 
KNS 1488PLUS & TURBO
Active
Make: KNS
Model: 1488PLUS & TURBO
Seller: cklee
Loc: Asia and Pacific - All
 
Palomar 2470-V / Virtually unused system for sale
Active
Make: Palomar / Hughes
Model: 2470-V
Seller: xenop
Loc: New York
WestBond 7400B West-Bond 7400B for sale
Active
Make: -
Model: 7400B
Seller: xenop
Loc: U.S.A.
 
WestBond 7400B West-Bond 7400B
Active
Make: WestBond
Model: 7400B
Seller: xenop
Loc: U.S.A.
NEC CPS610 VX, LED 6" Epoxy die bonder
Active
Make: NEC
Model: CPS610 VX
Seller: discosaw
Loc: Asia and Pacific - South Korea
ASM AD 819 Flip chip bonder
Active
Make: ASM
Model: AD 819-12
Seller: discosaw
Loc: Asia and Pacific - South Korea
 
Shibaura Mechatronix, Flip Chip Bonder,TFC-900
Active
Make: Shibaura Mechatronix
Model: TFC-900
Seller: i-TNS
Loc: Asia and Pacific - Japan
Shinkawa Wire Bonder UTC 200
Active
Make: Shinkawa
Model: UTC200
Seller: Sejung
Loc: Asia and Pacific - South Korea
K&S 8060 Wedge Bonder
Active
Make: K&S
Model: 8060
Seller: Sejung
Loc: Asia and Pacific - South Korea
High power LEDs Eutetic Die bonder Tosok DBD-4600S
Active
Make: Tosok
Model: DBD-4600S
Seller: discosaw
Loc: Asia and Pacific - South Korea
Lot Spare Parts for ESEC or Alphasem 8" D/B
Active
Make: ESEC, Alphasem
Model: 2006HRX, 2007, 9002,
Seller: Semimax
Loc: Asia and Pacific - South Korea
MicroAssembly MAT 6400 Automatic Die Attach System
Active
Make: MicroAssembly Technologies / Micro-Assembly (MAT)
Model: MAT 6400
Seller: testeqe
Loc: Arizona
Shinkawa UTC1000 super wire bonder
Active
Make: Shinkawa
Model: UTC1000 super
Seller: dynamicmos
Loc: Asia and Pacific - Other
West Bond 3700E Wire Bonder
Active
Make: West-Bond
Model: 3700E-90
Seller: member
Loc: Arizona
ASM AD809 MIL08 Multi-Wafer Die Attach
Active
Make: ASM
Model: ASM AD809 MIL08
Seller: Semimax
Loc: Asia and Pacific - South Korea
ASM Die Bonder AD889
Active
Make: ASM
Model: AD889
Seller: Condon
Loc: Asia and Pacific - China
ESEC Die Donder 2007 IC8
Active
Make: ESEC
Model: 2007 IC8 (D136)
Seller: Condon
Loc: Asia and Pacific - Other
ESEC Die Bonder 2007 HS PLUS
Active
Make: ESEC
Model: 2007 HS PLUS
Seller: Condon
Loc: Asia and Pacific - All
Semiconductor Equipment Corporation SEC Model 410
Active
Make: Semiconductor Equipment Corporation SEC
Model: 410
Seller: advotech
Loc: Arizona
ESEC Micron2 Flip Chip Bonder
Active
Make: ESEC
Model: Micron2 - Series 15
Seller: Oliver88
Loc: Asia and Pacific - Singapore
Pages: 1 2 3 4 5 6 7 Next
Related: Semiconductor Manufacturing, Wafer Inspection, Wafer Handling, CVD Equipment, Teradyne
See the list of equipment types for this subcategory
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